宝德塑胶金属零部件

宝德塑胶金属零部件（深圳）有限公司Established in 1928
Boyd Corporation is US company located in South Conifornia , US with 77 years history.
Boyd Corporation has evolved as the clear market leader in custom fabricated solutions for the electronics, transportation, and industrial markets.
Supporting our belief that people are our most valuable resource, Boyd dedicates the most experienced team in the industry towards the development of custom fabricated solutions. Boyds primary objective is to competitively support your specific product needs in the areas of: environmental seals and gaskets, EMI/RFI shielding, acoustical & thermal insulation, cushioning & shock absorption, thermal management, and bonding systems.
Boyds product development assistance unifies the concepts of industrial design, engineering, and manufacturing to speed time-to-market and optimize production. To ensure a high probability of success, cross-functional teams are assembled from disciplines that include mechanical design, material specification, tool making, project engineering, quality, and production to meet customer specific challenges. With a staff that recognizes the cost and timesaving importance of developing manufacturable product, Boyd provides assistance to enhance customers product development processes from initial investigation through final production.
The compressed product development cycles of todays dynamic marketplace demand swift results. Boyd integrates immediate access to a wide variety of materials with the rapid prototyping techniques of laser and waterjet to accelerate the prototype process. Same day or next day samples are often achievable.
Boyd Shenzhen is a new set up subsidiary of Boyd Corporation as an important step of Boyd Corporation long term strategy planning. She will play a very important role in corporate future business expansion.
本公司系美国独资企业，于1928在美国加州成立。是美国西部最大的定制弹性物料解决方案的制造商。目前公司共有五个工厂，分别位于加州的Modesto，Chino；俄勒冈州的Portland；佛罗里达的Gaffney及中国的深圳。深圳工厂位于宝安区龙华镇，总占地面积为2750平方米。主要经营及设计、开发塑料合金、合成橡胶、电磁和射频屏蔽、热绝缘体，绝缘成型件、高效电介屏蔽、汽车减震部件、减震垫、防震脚、缓冲器、光薄胶膜和新型电子元器件。