元瑞科技

ThermoShuttle Corp. ( TSC, 元瑞科技) is formerly founded in March, 2003. Its 　　founders and key members have accumulated more than 20 years experience and IPs in designing and manufacturing advanced thermal solutions, including vacuum soldered heatsink, vacuum brazed heatsink, reflow soldered heatsink, and vapor chamber. 

 TSC positions itself as an OEM/ODM thermal solution maker, serving worldwide cooler 　companies and IT companies. The following solutions are our recent focus:

1. Intel P4 heat sink families : Northwood(3.06 GHz only) , Prescott
2. Intel P5 heat sink series : Tejas 
3. AMD K7 heat sink series : 2200+, 2400+, 2600+, 2800+, 3200+
4. AMD K8 heat sink series : Athlon 64 
5. Thermal modules: integrated with heat pipes , vapor chamber, and other high-K components for server, miniPC, IPC, and NB applications. 
6. High-K interface materials: TMG 301. 
7. Thermal Modules for consumer electronics.